Lead Manufacturing Engineer, Sensors and Avionics

Job description

Job responsibilities

• Own manufacturing process development and documentation for PCBAs, box-level electronic assemblies and integrated electronic units, to space-grade workmanship standards (IPC-610/620 Class 3, IPC J-STD-001 Space…
• Own manufacturing and integration processes for sensor packages: visual and infrared optical trains, star and sun trackers, telescopes and interferometers — including optical alignment, cleanliness and contamination…
• Own processes for navigation and radar assemblies — GPS and IMU navigation solutions, radar apertures and front ends — including alignment, calibration interfaces and RF handling discipline.
• Own processes for communications assemblies across UHF through EHF bands — TT&C, command and control, and high-data-rate links — plus flight instrumentation.
• Own power systems and harnessing: power distribution assemblies, cable and harness build to IPC-620 and NASA-STD-8739.4, routing, bonding and grounding.
• Serve as the principal production technical interface to our internal sensor partners and to external component, sensor and box vendors, assessing capability and driving manufacturability and workmanship improvements…
• Drive Design for Manufacturability and Assembly into these designs before CDR, and use design and statistical process control to reduce production test burden rather than absorbing it.
• Specify and qualify the assembly tooling, fixtures and test equipment these assemblies need, and own root cause analysis, PFMEA, process validation and first article inspection for the processes you own.

Job requirements

• Bachelor's degree in Electrical, Mechanical, Manufacturing or Industrial Engineering, or a related technical discipline.
• 8+ years of manufacturing engineering experience in aerospace, space, defense or another high-reliability industry, with a track record taking electronic or electro-optical hardware from development into production.
• Deep knowledge of high-reliability electronics workmanship standards — IPC-610/620 Class 3, IPC J-STD-001 Space Addendum, and the NASA-STD-8739 series for soldering, wire harness and conformal coating.
• Expert understanding of PCBA processes (SMT, through-hole, conformal coating, potting, component selection and screening) and box-level assembly (cabling, harnessing, mechanical integration, thermal, EMI/EMC).
• Hands-on depth in at least two of: electro-optical or infrared sensor assembly and optical alignment; RF or radar assembly and test; navigation units (GPS, IMU); power distribution and harness manufacture.
• Has reduced production test burden through design or statistical process control — combining, moving or eliminating tests on the strength of data rather than absorbing whatever the design requires.
• Has served as the manufacturing technical interface to internal engineering partners or external electronics and sensor suppliers, including capability assessment and workmanship or process improvement.
• Demonstrated expertise in root cause analysis (8D, 5-Why, Fishbone), PFMEA, corrective and preventive action, process validation and first article inspection.