Principal RF/mmWave IC Layout Design Engineer – TeraWave

Job description

Job responsibilities

• Lead the physical design and implementation of state-of-the-art RF/mmWave ICs, including transmitter and receiver front-end blocks such as power amplifiers, low-noise amplifiers, phase shifters, variable-gain…
• Drive block-to-top integration, including chip-level floorplanning, power and ground planning, signal routing, ESD strategy, pad assembly, density fill, and design-for-manufacturability requirements.
• Lead compact chip-level integration approaches that optimize RF performance, isolation, area, reliability, and manufacturability.
• Perform and debug physical verification, including DRC, LVS, ERC, antenna checks, density checks, and related sign-off requirements.
• Support parasitic extraction and post-layout analysis; collaborate with circuit designers to resolve performance, coupling, EM, IR, reliability, and extraction-related issues.
• Develop layout schedules, identify implementation risks and dependencies, and deliver verified layouts aligned with program milestones and tape-out schedules.
• Prepare and release final layout databases to the foundry, including support for tape-out readiness reviews and mask database delivery.
• Lead layout reviews, define and document best practices, and mentor less-experienced layout engineers and designers.

Job requirements

• B.S. degree in Electrical Engineering, Electronic Engineering, Computer Engineering, or a related technical field.
• 10+ years of professional experience in RF/mmWave, analog, or mixed-signal custom IC layout and physical implementation.
• Extensive hands-on experience with high-frequency RF/mmWave IC layout in technologies such as RF CMOS, SOI, SiGe, or related advanced semiconductor processes.
• Successful completion of multiple IC product lifecycles or tape-outs, preferably including high-volume or mission-critical chipsets.
• Strong expertise in layout and integration of RF transmitter and receiver front-end circuits, including one or more full TX/RX chains.
• Direct experience laying out RF/mmWave blocks such as LNAs, PAs, mixers, VCOs, frequency synthesizers, phase shifters, VGAs, multipliers, and RF passives.
• Strong understanding of device-level layout techniques, including matching, symmetry, shielding, common-centroid layout, interdigitation, guard rings, and isolation structures.
• Strong understanding of parasitic effects, coupling mechanisms, grounding strategies, substrate noise isolation, differential routing, and RF signal integrity.