Senior Mechanical Simulation Engineer – Avionics & Electronics Packaging

Job description

Job responsibilities

• Own the simulation strategy for electronic modules and electromechanical assemblies throughout concept development, design, validation, production ramp, and field support.
• Develop structural finite element models for electronics housings, PCB assemblies, brackets, connectors, flex circuits, fasteners, heat sinks, shields, and integrated avionics modules.
• Perform static structural analyses including contact mechanics, bolt preload, fastener retention, housing deformation, sealing interfaces, component stresses, and structural load paths.
• Perform dynamic analyses including modal, harmonic response, random vibration, shock, and fatigue to evaluate durability throughout transportation, manufacturing, and flight environments.
• Develop thermal simulations for electronics cooling using conduction, convection, and radiation to ensure components remain within operating limits during all mission phases.
• Support development of cooling architectures including blowers, ducts, heat sinks, vapor chambers, thermal interface materials, cold plates, and enclosure ventilation.
• Evaluate thermo-mechanical behavior caused by coefficient of thermal expansion (CTE) mismatch across PCBAs, electronic packages, thermal interface materials, adhesives, housings, and structural interfaces.
• Predict PCB deformation, solder joint loading, package stresses, connector retention, and mechanical interactions resulting from thermal cycling and environmental loading.